Conductive adhesive

This electric conductive adhesive has high strength , high conductivity and excellent technology .

该导电胶具有高强度，高导电率及良好的工艺性等优点。

Study on Preparation and Properties of Isotropic Copper Filled Conductive Adhesive

各向同性铜粉导电胶的制备及性能研究

Experimental Study on Viscoelastic Mechanical Behaviors for Anisotropic Conductive Adhesive Film

各向异性导电胶膜黏弹性力学行为的实验研究

Application of Conductive Adhesive to Thin Film Adhesion Process

导电胶在薄膜粘接工艺中的应用

Study on Electric Property of Copper Conductive Adhesive

铜导电胶电性能的研究

The Recent Development of Anisotropic Conductive Adhesive Films for Microelectronic Packaging

微电子封装用各向异性导电胶膜的研究进展

Silver-coated Copper Power Loaded Conductive Adhesive Preparation and Make Sure the Best Process Condition

负载铜银粉导电胶制备的最佳工艺选择

This paper describes development and application of CLD - 20 structural electric conductive adhesive .

介绍了CLD－20结构型导电胶的研制及应用过程；

Study on the Room Temperature Fast-curing powered Copper Conductive Adhesive 254-21

254&21常温快固铜粉导电胶的研究

Research progress of the conductive adhesive

导电型胶粘剂的研究进展

Development and Application of CLD-20 Structural Electric Conductive Adhesive

CLD-20结构型导电胶的研制及应用

The Effect of Environment for the Anisotropic Conductive Adhesive Film ( ACF ) Capability Parameter

环境对各向异性导电胶膜性能参数的影响

Progress of Studies on Conductive Adhesive

导电胶粘剂的研究进展

Research on Nickel Powder Filled Acrylate Conductive Adhesive

镍粉导电丙烯酸酯压敏胶的研究

Progress of Anisotropic Conductive Adhesive for Flip Chip Packaging

倒装芯片封装材料&各向异性导电胶的研究进展

Conductive Adhesive for Surface Mount Devices

表面贴装器件的导电粘接

Study on Graphite Conductive Adhesive for Tantalum Capacitors

钽电容器用石墨导电胶的研究

The curing property of adhesive matrix is one of the key factors that determine the performances of conductive adhesive .

导电胶中基体胶的固化性能是影响导电胶使用可靠性的重要因素。

The disadvantages of three typical lead-free solders , and three problems in the conductive adhesive study are discussed .

文中介绍了三种典型无铅焊料体系的不足之处，以及银导电胶研究中的三个难题。

The effects of silver particles morphologies and size on the electrical bulk resistivity of conductive adhesive were described .

从导电性角度考查银粉颗粒形貌和粒径大小对导电胶电阻率的影响。

The resistivity of silver-plated glass fiber and the bulk resistivity of conductive adhesive were tested .

利用电阻率测试对镀银玻璃纤维的电阻率和导电胶的体积电阻率进行了研究。

Studies On Epoxy Resin-Low-molecular polyamide-Silver Powder Conductive Adhesive System

波导循环器波导环行器环氧-低分子聚酰胺-银粉导电胶体系研究

The percolation threshold was determined and the conducting pathway of the electric conductive adhesive was observed by SEM .

测得了导电胶的渗滤阈值并用扫描电镜（SEM）观察胶粘剂导电通道形成的过程。

Preparation of Ultrafine Silver Powder and Its Electrical Properties Effects of Morphologies and Size of Ag Particle on Electrical Performance of Conductive Adhesive

超细银粉的制备及其导电性研究银粉形貌与尺寸对导电胶电性能的影响

Heat ageing , natural ageing and water tolerance etc. tests are carried out to study and improve the ageing resistance of copper conductive adhesive .

将铜导电胶进行热老化、自然老化、耐水等试验，以研究其老化性能，并探求改善铜胶抗老化性能的途径。

The bulk resistance rate of the prepared conductive adhesive was 1.3 × 10 ~ ( 4 )Ω· cm and the influencing factors were also discussed .

对紫外光固化导电胶的影响因素进行了研究，制备出的导电胶体积电阻率可达（1.0~2.0）×10-4Ω.cm。

Copper conductive adhesive is prepared by using modified resins and mixed resins as cohesive materials and Copper powders as conductive fillers .

以改性树脂和混合树脂为粘料，铜粉为导电性填料，并配以适当添加剂、固化剂制备铜导电胶。

UV Curing copper or silver plating copper conductive adhesive was prepared by using acrylated epoxy resin or polyacrylic resin .

以环氧丙烯酸树脂和聚丙烯酸树脂，铜粉和镀银铜粉制备了四种不同品种的紫外光固化导电胶。

In this paper , the thermal conducting mechanism and models of thermal conductive adhesive were described , and the approaches of improving thermal conducting were also discussed .

介绍了导热绝缘聚合物复合材料，包括复合型塑料、橡胶、胶粘剂和涂层的研究进展及其导热机理、导热模型的研究情况。

In the paper , classification of the conductive adhesive , conductive mechanism and making up were summarized , the development prospect of the conductive adhesive was put forward .

综述了导电胶粘剂的分类、导电机理及导电胶粘剂的组成，指出导电胶粘剂的研究正向高导电率、低热阻、更可靠性的多功能化方向发展，并预期导电胶粘剂的应用前景是广阔的。